Catalyst Equipment Used Semiconductor Equipment .
For 25 years, we have been buying and selling all types of used and refurbished semiconductor equipment from wafer manufacturing through fabrication to backend ...
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For 25 years, we have been buying and selling all types of used and refurbished semiconductor equipment from wafer manufacturing through fabrication to backend ...
Lapping, optical polishing, low stress grinding, diamond machining and honing services. Process details, trade show information, articles.
Products for DBG Process. BG Tape for DBG Process This is a back grinding tape that fully prevents infiltration of grinding fluid during polishing, as well as the ...
Leadingedge Tape B!_ (B Equipment solution created with semiconductorrelated products ''Adwill.'' Fully and semiautomatic wafer mounters for the dicing process.
DISCO CONFIDENTIAL only for customer ¤2013 DISCO CORPORATION All rights reserved Solutions for thinning, dicing and packaging of power devices
Syagrus Systems thin wafer backgrinding and silicon wafer thinning services meets company''s demands for extremely thin silicon wafers for use in complex applications.
Because in DBG thinned wafers are never transported, waferlevel breakage is greatly reduced; and because die separation occurs during the grinding process, the ...
Types of Wafer Substrates. A wafer after cleanroom fabrication, ready to be processed into individual parts and packaged.
Engis EHG Horizontal Grinding machines are perfect for backthinning or preparing wafers such as sapphire. Highest level of flatness and surface finish!
ICROS TAPE is used to manufacture integrated circuits as a surface protective tape in the silicon wafer backgrinding process.
The EquipNet MarketPlace™ is the largest website in the world for buying and selling preowned, used and unused industrial assets.
Thin Silicon Wafers 2um, 5um, 10um, 25um, 50um, 100um all specs to 10mm thick all types and dopants silicon single and double side polsihed and more including, GaAs ...
Grinding and Polishing GRINDING removes saw marks and levels and cleans the specimen surface. Polishing removes the artifacts of grinding but very little stock.
INTECH | Intech Technologies International (S) Pte. Ltd. We are a team of an experienced energetic entrepreneurs that started INTECH back in year 2008.
Our products contribute to improve the workability of the quality in the backgrinding process and productivity in dicing process of the Semiconductor manufacturing ...
Browse GlobalSpec''s Datasheet directory to locate information and specifications for more than 8 million products. The archive is organized by product area; view ...
Dental veneers (sometimes called porcelain veneers or dental porcelain laminates) are waferthin, custommade shells of toothcolored materials designed to cover the ...
The 3M ™ Wafer Support System combines proprietary 3M temporary bonding technologies with world class equipment designed specifically to process wafers using
Wafer Works'' polished silicon wafers consist of 4" 8" low defect, superior flatness silicon wafers, containing dopants such as boron, phosphorus, arsenic, and ...
Sapphire Lapping and Polishing Process Single Crystal Sapphire. The use of Single Crystal Sapphire, as a high quality original optomechatronic material in the ...
Silicon Wafer Bonding Process. This page contains the basic steps for the successful bonding of silicon wafers. Cleaning Process for Silicon Wafers
The TAIKO process is a wafer backgrinding method developed by DISCO Corporation. This process method leaves a ring, approximately on the wafer outer ...
Wafer Works also provides highquality 4" 8" epitaxial wafers and buried layer epitaxial process services, meeting customer''s power device and CMOS demands and ...
Semiconductor Wafer Edge Analysis/4 Stricter requirements in the wafer manufacturing process have made edge measurements important for both 200 mm and .
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